FREMONT, Calif., March 10, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Designed for integration into high-speed bottling lines with spray-coating units, the coating is suitable for PET, PP, and PC ...
Manz AG, a global high-tech engineering company with a comprehensive technology portfolio, showcases its high-density packaging production solutions at the SEMICON Southeast Asia 2023 on May 23-25 in ...
Electroplating is a technique that uses an electrical current to deposit a thin layer of metal onto a surface. It is widely used across industries to enhance material properties, such as durability, ...
The Interdisciplinary Institute for Technological Innovation (3IT) at Quebec's Université de Sherbrooke has purchased ClassOne Technology's Solstice® LT plating system for advanced packaging R&D ...
What if there is a biodegradable packaging material with high performance without leaving microplastics? Plastic pollution presents a global challenge that must be solved. In particular, packaging ...
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